First of all, I'd like to espress my satisfaction for TMP006, I'm sure that it gives a great number of possibilities to developers.
My application require a fast measure of skin temperature with high sensibility on a small size of skin, (quite easy, isn't it? :-)
Thanks to all questions and answers posted before, I was impressed by the fact that die temperature is a reference for the measure; so I prototyped a shield for entire TMP006 breakout board with internally reflective aluminium foil that is heated to the Die Temperature with a PWM PID controller.
The shield have a window large as the chip.
(Another test may be driven using a Peltier Cooler to explore measure with Die Temperature below ambient temperature.)
Actually the measures are instable and I think it is caused by mechanical and thermal tolerance caused by manually prototyped parts.
I'd like to have your opinion about this approach. Is it a way to improve or discard ?
Thank you very much
Greetings from Italy
Fausto Bastianello fausto@amotion.it
