Tanner,
I'll do my best to answer your questions, however much of the information that you are requesting is up to the engineers creating the product (you and your team in this case) to decide. To start, the TMP006 is an IR thermopile sensor that is usually soldered directly to the printed circuit board (PCB) of the phone or other device, inside the phone. The TMP006 comes in a chip-scale package and is therefore very small, about 2mm square and requires precise placement and a professional reflow soldering process to ensure it is properly connected to the PCB. The device communicates using the SMBus protocol, which is a 2-wire interface similar to I2C, and is intended for the peripheral devices of microcontrollers or microprocessors. The best source for this information is:
The TMP006 datasheet: http://www.ti.com/lit/ds/symlink/tmp006.pdf
The TMP006 user guide: http://www.ti.com/lit/ug/sbou107/sbou107.pdf
In applications like a smart phone, the customer chooses their processor and writes software for the processor that configures some of its output pins for SMBus communication, and uses these pins to communicate with the TMP006 for calibration and measurement. As for software for writing apps, this depends on the team's choice of processor, not on the TMP006 itself.